As industrial and commercial UAVs continue to evolve, their PCBs are no longer basic carriers—they’re core hardware that dictates flight performance, anti-interference capability, endurance and safety. Driven by high-load flight and strong electromagnetic interference, UAV PCBs demand advanced standards: more layers, high-density interconnect (HDI), superior thermal management, precise copper thickness control and strict dimensional stability.
 
Core UAV PCB Types & Requirements
 
- Flight Controller PCB: High-speed signals, strict impedance control & EMI/EMC performance; HDI + micro blind via design for high-density, miniaturized layout.
- ESC PCB: High-current driving core; ≥2–3oz heavy copper, enhanced vias & metal cladding to handle high-load operations.
- PDB/BMS PCB: PDB prioritizes copper thickness & heat dissipation; BMS focuses on electrical stability for battery protection.
- Comm/Navigation/Image Transmission PCB: High-frequency performance & impedance control; small-size HDI or rigid-flex structure for EMC sensitivity.
 
Critical Manufacturing & Material Tips
 
- High-TG Substrates: Resist high temperatures during high-speed flight to avoid circuit failures.
- Heavy Copper & Via Control: 3oz copper for optimized current carrying; ≥35μm via copper ensures stable transmission in high-current loops.
- Microvia & Half-Hole Tech: Boost wiring density in space-constrained designs; improve production yield.
- ENIG Surface Finishing: 0.05um ENIG delivers reliable solderability & long-term oxidation resistance.
- Metal Cladding: Enhances heat dissipation & mechanical strength, preventing thermal deformation.
 
Quality Control Highlights
 
- Precision drilling, automated electroplating & stable lamination processes tailored for heavy copper/HDI structures.
- In-process checks (AOI, impedance testing) + final verification (flying probe, thermal shock tests) to guarantee long-term reliability in extreme operating conditions.