Solder beads are a common defect after SMT reflow soldering and can easily cause short circuit risks. To control solder beads, start with the stencil aperture design — appropriately reduce the aperture size or switch to anti-solder-bead apertures. Next, ensure the reflow temperature profile is reasonable and avoid too rapid a preheat ramp-up that can cause flux spattering. Additionally, make sure solder paste is fully brought to room temperature and stirred well; maintaining workshop humidity at 40–60% also helps reduce solder bead formation. When solder beads appear, clean them promptly and check the oven temperature and solder paste condition to solve the problem at its source.