PC-ESD-2020
A joint standard for the development of electrostatic discharge (ESD) control programs. It covers the necessary design, establishment, implementation and maintenance of ESD control programs, and provides guidance for the handling and protection of ESD-sensitive components based on the historical experience of certain military and commercial organizations.
 
IPC-SA-61A
Post-Soldering Semi-Aqueous Cleaning Handbook. It includes all aspects of semi-aqueous cleaning, such as chemistry, production residues, equipment, processes, process control, as well as environmental and safety considerations.
 
IPC-AC-62A
Post-Soldering Aqueous Cleaning Handbook. It describes manufacturing residues, types and properties of aqueous cleaners, aqueous cleaning processes, equipment and techniques, quality control, environmental control, employee safety, as well as the determination of cleanliness and the associated costs.
 
IPC-DRM-40E
Through-Hole Solder Joint Evaluation Desktop Reference Manual. It provides detailed descriptions of components, hole walls, solder joint coverage, etc., in accordance with standard requirements, and also includes computer-generated 3D graphics. It covers solder fill, contact angle, wetting, vertical fill, pad coverage, and numerous solder joint defect conditions.
 
IPC-TA-722
Soldering Technology Assessment Manual. It contains 45 articles covering various aspects of soldering technology, including general soldering, soldering materials, manual soldering, batch soldering, wave soldering, reflow soldering, vapor phase soldering and infrared soldering.
 
IPC-7525
Stencil Design Guidelines. It provides guidelines for the design and manufacture of stencils for solder paste and surface mount adhesive application. It also discusses stencil design for surface mount technology (SMT) applications, and introduces hybrid technologies with through-hole or flip-chip components, including step printing, double printing and stage stencil design.
 
IPC/EIAJ-STD-004
Flux Specification Requirements - Including Appendix I. It contains technical specifications and classifications for rosin, resins, etc., and classifies organic and inorganic fluxes based on halide content and activation level. It also covers flux application, flux-containing materials, and low-residue fluxes used in no-clean processes.
 
IPC/EIAJ-STD-005
Solder Paste Specification Requirements - Including Appendix I. It lists the characteristics and technical requirements of solder paste, as well as standard test methods and metal content specifications, along with viscosity, slump, solder balling, tackiness and solder paste wetting performance.
 
IPC/EIAJ-STD-006A
Specification Requirements for Electronic-Grade Solder Alloys, Fluxed and Non-Fluxed Solid Solders. It provides terminology, specifications and test methods for electronic-grade solder alloys, fluxed and non-fluxed solders in bar, ribbon and powder forms, for electronic soldering applications, and for special electronic-grade solders.
 
IPC-CA-821
General Requirements for Thermally Conductive Adhesives. It includes requirements and test methods for thermally conductive dielectrics used to attach components to their intended positions.
 
IPC-3406
Guidelines for Conductive Surface Mount Adhesives. It provides guidance for the selection of conductive adhesives as alternatives to soldering in electronic manufacturing.
 
IPC-AJ-820
Assembly and Soldering Handbook. It contains descriptions of inspection techniques for assembly and soldering, including terminology and definitions; types of printed circuit boards, components and leads; solder joint materials; component mounting; design specification references and outlines; soldering technologies and packaging; cleaning and coating; quality assurance and testing.
 
IPC-7530
Temperature Profiling Guidelines for Mass Soldering Processes (Reflow and Wave Soldering). It adopts various testing tools, techniques and methods in temperature profile acquisition, and provides guidance for establishing optimal profiles.
 
IPC-TR-460A
Printed Circuit Board Wave Soldering Troubleshooting Checklist. It is a recommended list of corrective actions for potential defects caused by wave soldering.
 
IPC/EIA/JEDEC J-STD-003A
Solderability Tests for Printed Circuit Boards.
 
J-STD-013
Application of Ball Grid Array (BGA) and Other High-Density Technologies. It establishes the specifications and interactions required for printed circuit board packaging processes, provides information for high-performance and high-pin-count integrated circuit (IC) package interconnections, including design principles, material selection, board manufacturing and assembly techniques, test methods, and reliability expectations based on end-use environments.
 
IPC-7095
Design and Assembly Process Supplements for BGA Devices. It provides various useful operational information for those using BGA devices or considering transitioning to array package formats. It offers guidance for BGA inspection and rework, and provides reliable information in the field of BGA technology.
 
IPC-M-108
Cleaning Guidelines Manual. It includes the latest version of IPC cleaning guidelines, providing assistance to manufacturing engineers in determining product cleaning processes and troubleshooting.
 
IPC-CH-65-A
Cleaning Guidelines in Printed Circuit Board Assembly. It provides a reference for current and emerging cleaning methods in the electronics industry, including descriptions and discussions of various cleaning methods, and explains the relationships between various materials, processes and contaminants in manufacturing and assembly operations.
 
IPC-SC-60A
Post-Soldering Solvent Cleaning Handbook. It presents the use of solvent cleaning techniques in automatic and manual soldering, discusses solvent properties, residues, as well as process control and environmental issues.
 
IPC-9201
Surface Insulation Resistance (SIR) Handbook. It contains terminology, theory, test procedures and test methods for surface insulation resistance (SIR), and also includes temperature-humidity (TH) testing, failure modes and troubleshooting.
 
IPC-DRM-53
Introduction to Electronic Assembly Desktop Reference Manual. It uses illustrations and photos to explain through-hole mounting and surface mount assembly technologies.
 
IPC-M-103
Surface Mount Assembly Handbook Standard. This section includes all 21 IPC documents related to surface mount technology.
 
IPC-M-104
Printed Circuit Board Assembly Handbook Standard. It contains 10 of the most widely used documents related to printed circuit board assembly.
 
IPC-CC-830B
Performance and Qualification of Electronic Insulating Compounds in Printed Circuit Board Assembly. An industry standard for the quality and qualification of conformal coatings.
 
IPC-S-816
Surface Mount Technology (SMT) Process Guidelines and Checklists. This troubleshooting guide lists all types of process problems encountered in surface mount assembly and their solutions, including bridging, insufficient solder, component misalignment, etc.
 
IPC-CM-770D
Component Mounting Guidelines for Printed Circuit Boards. It provides effective guidance for component preparation in printed circuit board assembly, and reviews relevant standards, impacts and releases, including assembly technologies (manual and automatic, as well as surface mount technology and flip-chip assembly technologies) and considerations for subsequent soldering, cleaning and coating processes.
 
IPC-7129
Calculation of Defects Per Million Opportunities (DPMO) and Printed Circuit Board Assembly Manufacturing Metrics. It provides an acceptable method for calculating DPMO benchmark metrics, which are industry-agreed benchmarks for measuring defects and quality.
 
IPC-9261
Printed Circuit Board Assembly Yield Estimation and Defects Per Million Opportunities During Assembly. It defines a reliable method for calculating DPMO during printed circuit board assembly, serving as a measurement standard for evaluating various stages of the assembly process.
 
IPC-D-279
Design Guidelines for Reliable Surface Mount Technology Printed Circuit Board Assembly. A guide for the reliable manufacturing process of printed circuit boards using surface mount technology and hybrid technology, including design concepts.
 
IPC-2546
Combined Requirements for Transfer Points in Printed Circuit Board Assembly. It describes material handling systems, such as conveyors and buffers, manual placement, automatic screen printing, automatic adhesive dispensing, automatic surface mount placement, automatic through-hole placement, forced convection, infrared reflow ovens and wave soldering equipment.
 
IPC-PE-740A
Troubleshooting in Printed Circuit Board Manufacturing and Assembly. It includes case records and corrective actions for problems arising during the design, manufacturing, assembly and testing of printed circuit products.
 
IPC-6010
Printed Circuit Board Quality Standards and Performance Specifications Series Handbook. It includes quality standards and performance specifications for all printed circuit boards formulated by the Institute for Printed Circuits (IPC).
 
IPC-6018A
Inspection and Testing of Microwave Finished Printed Circuit Boards. It includes performance and qualification requirements for high-frequency (microwave) printed circuit boards.
 
IPC-D-317A
Design Guidelines for Electronic Packaging Using High-Speed Technologies. It provides guidance for the design of high-speed circuits, including mechanical and electrical considerations, as well as performance testing.