Transforming your innovative electronic product from a design blueprint into a functional entity requires a crucial conversion process – PCBA (Printed Circuit Board Assembly). This is more than just soldering components onto a circuit board; it is a highly precise engineering art that directly determines the product's performance, stability, and ultimate user experience.
 
We understand that a high-quality PCBA serves as the cornerstone of product reliability. Therefore, we adopt a rigorous attitude toward every assembly detail. In Surface Mount Technology (SMT), we employ industry-leading automated equipment such as high-speed chip mounters, which can achieve precise placement of ultra-miniature components in 01005 packaging (0.4mm x 0.2mm) with a placement accuracy of up to ±25 microns. This ensures accurate positioning of complex chips and micro-components in extremely small spaces, avoiding electrical performance issues caused by misalignment. Meanwhile, we strictly control the reflow soldering temperature curve to ensure the fullness and reliability of solder joints – for example, the solder joint void rate is typically controlled below 5%, effectively reducing risks such as dry soldering and false soldering.
 
For areas requiring high current or mechanical stress, we use selective wave soldering or manual soldering processes to ensure firm connections. For instance, for high-power inductors or connectors in power modules, we use specific soldering parameters to make solder joints meet the highest strength standards specified in IPC Class 2/3, capable of withstanding a tensile force of up to 200N. In addition, to address harsh working environments, we provide professional conformal coating services, using materials such as acrylic, polyurethane, or silicone with a coating thickness precisely controlled at 25-75 microns. This provides comprehensive protection against moisture, dust, salt spray, and corrosion for PCBA, ensuring long-term stable operation of products under extreme conditions.
 
Quality control penetrates every link of PCBA assembly. We introduce advanced AOI (Automated Optical Inspection) equipment to conduct comprehensive inspections of solder joint quality, component polarity, and placement errors or omissions, supplemented by X-Ray inspection to perform non-destructive fluoroscopy of solder joints at the bottom of packages such as BGA and QFN, ensuring all hidden defects are detected. Finally, each PCBA will undergo strict verification through ICT (In-Circuit Test) and FCT (Functional Test) to ensure its electrical functions and overall performance fully meet design requirements.
 
Choosing our PCBA services means your products will receive high-quality process guarantees. We control every detail to ensure your innovative products can successfully enter the market with superior performance and unparalleled reliability.